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Dongguan Ziitek Electronic Materials & Technology Ltd.
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1.0mmt Soft Compressible Gap Pad Thermal Conductivity For Memory Modules

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Product Details
Brand Name: ZIITEK
Model Number: TIF140-30-02US
Certification: UL and RoHs
Place of Origin: China
Minimum Order: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Outgasing (TML): 0.35%
name: 1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules
keyword: thermal gap pad
Construction & Compostion: Ceramic filled silicone elastomer
hermal conductive: 3.0W/mk
Thickness: 1.0mmT
Description
1.0mmT Soft and compressible for Low Stress Applications Silicone Pads for Memory Modules The TIF140-30-02US use a special process, with silicone as ...

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